Improving the quality of barrier/seed interface by optimizing physical vapor deposition of Cu Film in hollow cathode magnetron
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چکیده
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منابع مشابه
Flux and energy analysis of species in hollow cathode magnetron ionized physical vapor deposition of copper.
To meet the stringent requirements of interconnect metallization for sub-32 nm technologies, an unprecedented level of flux and energy control of film forming species has become necessary to further advance ionized physical vapor deposition technology. Such technology development mandates improvements in methods to quantify the metal ion fraction, the gas∕metal ion ratio, and the associated ion...
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In this paper, the resonance optical absorption method, is used to measure the Cu atoms number density in different power levels of power supply. Atoms are sputtered from a Cu target during plasma magnetron sputtering deposition. For the light source, a commercial Cu hollow cathode lamp is used. For measurement of gas temperature, a small percentage of N2 is added to the gas mixture and the gas...
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